Skip to content
UPFind
  • 書包: 0 items (滿)
  • 語言
    • English
    • Deutsch
    • Español
    • Français
    • Italiano
    • 日本語
    • Nederlands
    • Português
    • Português (Brasil)
    • 中文(简体)
    • 中文(繁體)
    • Türkçe
    • עברית
    • Gaeilge
    • Cymraeg
    • Ελληνικά
    • Català
    • Euskara
    • Русский
    • Čeština
    • Suomi
    • Svenska
    • polski
    • Dansk
    • slovenščina
    • اللغة العربية
    • বাংলা
    • Galego
    • Tiếng Việt
    • Hrvatski
    • हिंदी
    • Հայերէն
    • Українська
    • Sámegiella
    • Монгол
    • Maaori
高級檢索
  • Modeling and application of fl...
  • 引用
  • 推薦此
  • 打印
  • 導出紀錄
    • Export toRefWorks
    • Export toEndNoteWeb
    • Export toEndNote
    • Export toMARC
    • Export toMARCXML
  • 添加到書包 從書包裡刪除
  • Permanent link
封面圖片
QR Code
Preview
Preview
Preview

Modeling and application of flexible electronics packaging

書目詳細資料
Main Authors: Huang, YongAn (Author), Wan, Xiaodong (Author), Yin, Zhouping (Author)
企業作者: SpringerLink (Online service)
格式: Electronic Resource
語言:英语
出版: Singapore Springer [2019]
版:First edition.
主題:
Computer simulation.
Electronic materials.
Electronics.
Manufactures.
Mechanics, Applied.
Mechanics.
Microelectronics.
Optical materials.
Electronic books.
在線閱讀:Available for University of the Philippines Diliman via SpringerLink. Click here to access
Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
  • 持有資料
  • 實物特徵
  • 書本目錄
  • Preview
  • 職員瀏覽

相似書籍

  • Notes on projectile impact analyses
    由: Wu, Hao, et al.
    出版: (2020)
  • Printed flexible sensors fabrication, characterization and implementation
    由: Nag, Anindya, et al.
    出版: (2019)
  • Advances in materials, mechanics and manufacturing proceedings of the second International Conference on Advanced Materials, Mechanics and Manufacturing (A3M'2018), December 17-19, 2018 Hammamet, Tunisia
    出版: (2020)
  • Mechanics of additive and advanced manufacturing, volume 8 proceedings of the 2018 annual conference on experimental and applied mechanics
    出版: (2019)
  • Journal of Electronic Packaging [ejournal].
    出版: (1989)

Search Options

  • 檢索歷史
  • 高級檢索

Discover More

  • 瀏覽目錄
  • Explore Channels

Need Help?

  • 檢索技巧
  • 咨詢台
  • 常見問題

More Information

  • About Tuklas
  • Contact Us

TUKLAS: UP Libraries' Resource Discovery Tool
Copyright © 2020-2021. The University Library, University of the Philippines Diliman