Modeling and application of flexible electronics packaging
Main Authors: | , , |
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企業作者: | |
格式: | Electronic Resource |
語言: | 英语 |
出版: |
Singapore
Springer
[2019]
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版: | First edition. |
主題: | |
在線閱讀: | Available for University of the Philippines Diliman via SpringerLink. Click here to access Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy |