Modeling and application of flexible electronics packaging
| 主要な著者: | , , |
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| 団体著者: | |
| フォーマット: | Electronic Resource |
| 言語: | 英語 |
| 出版事項: |
Singapore
Springer
[2019]
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| 版: | First edition. |
| 主題: | |
| オンライン･アクセス: | Available for University of the Philippines Diliman via SpringerLink. Click here to access Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy |