Modeling and application of flexible electronics packaging
| Hlavní autoři: | , , |
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| Korporativní autor: | |
| Médium: | Electronic Resource |
| Jazyk: | angličtina |
| Vydáno: |
Singapore
Springer
[2019]
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| Vydání: | First edition. |
| Témata: | |
| On-line přístup: | Available for University of the Philippines Diliman via SpringerLink. Click here to access Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy |