Modeling and application of flexible electronics packaging
| Main Authors: | , , |
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| Corporate Author: | |
| Format: | Electronic Resource |
| Language: | English |
| Published: |
Singapore
Springer
[2019]
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| Edition: | First edition. |
| Subjects: | |
| Online Access: | Available for University of the Philippines Diliman via SpringerLink. Click here to access Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy |