TY  - GEN
T1  - Modeling and application of flexible electronics packaging
A1  - Huang, YongAn
A1  - Wan, Xiaodong
A1  - Yin, Zhouping
LA  - English
PP  - Singapore
PB  - Springer
YR  - 2019
ED  - First edition.
UL  - http://www.ds.mainlib.upd.edu.ph/Record/UP-99796217613747188
SN  - 9789811336270 (eBook ISBN)
KW  - Computer simulation.
KW  - Electronic materials.
KW  - Electronics.
KW  - Manufactures.
KW  - Mechanics, Applied.
KW  - Mechanics.
KW  - Microelectronics.
KW  - Optical materials.
KW  - Electronic books.
ER  -